Superior EMI Shielding and Grounding Solutions
In modern electronic assembly and IoT device manufacturing, managing electromagnetic interference (EMI) while filling structural gaps is essential. Our conductive foam tapes combine compressible, high-resilience foam substrates with highly conductive metallic fabrics to deliver exceptional shielding and grounding performance.
Technical Features & Applications:
- EMI Shielding & Grounding: Features low surface electrical resistance, effectively blocking electromagnetic and radio frequency interference while providing reliable grounding paths within electronic devices.
- Gap-Filling & Cushioning: The compressible foam core adapts seamlessly to uneven interior structures, providing excellent gap-filling, mechanical cushioning, and vibration dampening.
- Strong Adhesive Bonding: Backed by high-performance conductive adhesives that ensure long-term electrical continuity and secure structural bonding in tight device enclosures.
We assist engineers worldwide by providing customized die-cut shapes and specific thicknesses to match the compact spatial designs of modern electronics.
